Thermal conduction of a circular inclusion with variable interface parameter.

DOI10.1016/S0020-7683(00)00191-8MaRDI QIDQ5933933zbMATH OpenFDO

Authors T. Chen

Publication date 2001

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/S0020-7683(00)00191-8

Mathematics Subject Classification ID

Cited in

(6)

• New phenomena concerning a screw dislocation interacting with two imperfect interfaces
• Two circular inclusions with arbitrarily varied surface effects
• Scattering of antiplane shear wave by a piezoelectric circular cylinder with an imperfect interfaces
• The analysis of inter-laminar stress and electric potential for a laminated piezoelectric plate with interfacial damage
• Two models of three-dimensional thin interphases with variable conductivity and their fulfillment of the reciprocal theorem
• Thermal Green's functions in plane anisotropic bimaterials with spring-type and Kapitza-type imperfect interface

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