Thermal fracture interference: a two-dimensional boundary element approach

DOI10.1007/S10704-005-1890-XMaRDI QIDQ1959857zbMATH OpenOpenAlexFDO

Authors G. I. Giannopoulos, Nikolaos K. Anifantis

Publication date 12 October 2010

Published in International Journal of Fracture (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1007/s10704-005-1890-x

zbMATH Keywords

boundary element analysiscrack closurefrictional contact analysisincremental procedurestress intensity factorthermal shock

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Brittle fracture (74R10) Boundary element methods applied to problems in solid mechanics (74S15)

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Cites work

• Bem frictional contact analysis: Load incremental technique
• On the computation of mode I and II thermal shock stress intensity factors using a boundary‐only element method
• On the use of quarter-point boundary elements for stress intensity factor computations
• Performance of quarter-point boundary elements in analysing thermally stressed kinked and curved cracks
• The Penny-Shaped Interface Crack With Heat Flow, Part 1: Perfect Contact

Cited in

(8)

• A singular element based on dual interpolation BFM for V-shaped notches
• A BEM analysis for thermomechanical closure of interfacial cracks incorporating friction and thermal resistance
• Boundary integral equations and the boundary element method for fracture mechanics analysis in 2D anisotropic thermoelasticity
• Effect of frictional heating on the propagation of surface crack under Hertzian contact loading
• Interfacial steady‐state and transient thermal fracture of dissimilar media using the boundary element contact analysis
• Boundary element analysis of cracked homogeneous or bi-material structures under thermo-mechanical cycling
• Modeling of heat transfer and thermal cracking in brittle materials using finite-discrete element method (FDEM) with a heat pipe model and node binding scheme
• BEM formulation for simulating heat dissipation in microelectronic packaging with point heat sources

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