Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates (Q399557): Difference between revisions
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| Property / cites work: Investigating the deformation of nanocrystalline copper with microscale kinematic metrics and molecular dynamics / rank | |||
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| Property / cites work: The loading history and crystal orientation effects on the size-dependency of single crystal diamond properties / rank | |||
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| Property / cites work: Fast parallel algorithms for short-range molecular dynamics / rank | |||
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| Property / cites work: A study of mechanical properties of pure and nitrogen-doped ultrananocrystalline diamond films under various loading conditions / rank | |||
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| Property / cites work: A multi-scale simulation of tungsten film delamination from silicon substrate / rank | |||
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Latest revision as of 22:46, 8 July 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates |
scientific article |
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Combined grain size, strain rate and loading condition effects on mechanical behavior of nanocrystalline Cu under high strain rates (English)
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19 August 2014
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nanocrystalline Cu
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molecular dynamics
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grain boundaries
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grain size
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high strain rates
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uniaxial stress
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uniaxial strain
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