Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives (Q2655570): Difference between revisions
From MaRDI portal
Created a new Item |
Set OpenAlex properties. |
||
(2 intermediate revisions by 2 users not shown) | |||
Property / MaRDI profile type | |||
Property / MaRDI profile type: MaRDI publication profile / rank | |||
Normal rank | |||
Property / OpenAlex ID | |||
Property / OpenAlex ID: W2076299404 / rank | |||
Normal rank | |||
links / mardi / name | links / mardi / name | ||
Latest revision as of 00:39, 20 March 2024
scientific article
Language | Label | Description | Also known as |
---|---|---|---|
English | Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives |
scientific article |
Statements
Investigation of wall-slip effect on lead-free solder paste and isotropic conductive adhesives (English)
0 references
25 January 2010
0 references
wall-slip
0 references
solder paste
0 references
rheology
0 references
isotropic conductive adhesives
0 references
stencil printing process
0 references