A new thermoelectroelastic solution for piezoelectric materials with various openings (Q1818657): Difference between revisions

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+Q3236400
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+Thermal Stresses Due to Disturbance of Uniform Heat Flow by an Insulated Ovaloid Hole
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+Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium
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+Anisotropic Plates With Various Openings Under Uniform Loading or Pure Bending
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+New developments concerning piezoelectric materials with defects
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+Piezoelectric solid with an elliptic inclusion or hole
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+Plane problems in piezoelectric media with defects
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+Crack Extension Force in a Piezoelectric Material
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