A new thermoelectroelastic solution for piezoelectric materials with various openings
DOI10.1007/BF01179544zbMATH Open0951.74019MaRDI QIDQ1818657FDOQ1818657
Authors: Qing H. Qin, Yiu-Wing Mai 
Publication date: 4 January 2001
Published in: Acta Mechanica (Search for Journal in Brave)
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conformal mappinghoop stresscomplex potentialcrack problemsstrain energy release rateLekhnitskii's formulationelectric displacementinfinite piezoelectric plateinsulated holestress-electric displacement intensity factorthermoelectroelastic analysis
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Cites Work
- Plane problems in piezoelectric media with defects
- Crack Extension Force in a Piezoelectric Material
- Piezoelectric solid with an elliptic inclusion or hole
- New developments concerning piezoelectric materials with defects
- Thermal Stresses Due to Disturbance of Uniform Heat Flow by an Insulated Ovaloid Hole
- Plane Thermal Stress at an Insulated Hole Under Uniform Heat Flow in an Orthotropic Medium
- Anisotropic Plates With Various Openings Under Uniform Loading or Pure Bending
- Title not available (Why is that?)
Cited In (6)
- An exact and explicit treatment of an elliptic hole problem in thermopiezoelectric media
- Some results on thermoelasticity for porous piezoelectric materials
- General solutions for thermopiezoelectrics with various holes under thermal loading
- The general solution for a finite thermopiezoelectric plate containing a hole and a crack
- Prediction of mechanical property of open-hole composite laminates using generalized regression neural network method
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