Some problems in plane thermopiezoelectric materials with holes

DOI10.1016/S0020-7683(98)00032-8MaRDI QIDQ1303073zbMATH OpenOpenAlexWikidataFDO

Authors V. Pereyra

Publication date 21 August 2000

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0020-7683(98)00032-8

zbMATH Keywords

analytical solutionconcentration coefficientsconformal mappingelectric displacementenergy release ratestress intensity factorsStroh formalism

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Stress concentrations, singularities in solid mechanics (74G70)

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(15)

• The general solution for a finite thermopiezoelectric plate containing a hole and a crack
• Plane problems in piezoelectric media with defects
• Green's function for thermopiezoelectric plates with holes of various shapes
• General solutions for thermopiezoelectrics with various holes under thermal loading
• Method of fundamental solutions for 3D elasticity with body forces by coupling compactly supported radial basis functions
• A new thermoelectroelastic solution for piezoelectric materials with various openings
• An exact and explicit treatment of an elliptic hole problem in thermopiezoelectric media
• The generalized two dimensional thermal-electro-elastic solution for the cracked-half-elliptical-hole problem in a half plane
• Stress concentration in composite piezoceramic plate with holes
• Hybrid fundamental solution based finite element method: theory and applications
• Compressibility of two-dimensional pores having n -fold axes of symmetry
• A new hybrid finite element approach for plane piezoelectricity with defects
• Voronoi polygonal hybrid finite elements and their applications
• A permeable interface crack between dissimilar thermopiezoelectric media
• Thermoelastic plane problems with curvilinear boundaries

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