General solutions for thermopiezoelectrics with various holes under thermal loading

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Publication:1579965

DOI10.1016/S0020-7683(99)00225-5zbMath0999.74052OpenAlexW2094972730MaRDI QIDQ1579965

Qing-Hua Qin

Publication date: 28 November 2002

Published in: International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/s0020-7683(99)00225-5



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