General solutions for thermopiezoelectrics with various holes under thermal loading

DOI10.1016/S0020-7683(99)00225-5MaRDI QIDQ1579965zbMATH OpenOpenAlexFDO

Authors Qing H. Qin

Publication date 28 November 2002

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0020-7683(99)00225-5

zbMATH Keywords

circlefractureinfinite piezothermoelastic plateintegral equationinteraction between crack and holemethod of conformal mappingspoint heat sourcesquare holestationary solutionStroh's formalismtemperature discontinuityuniform heat flow

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Stress concentrations, singularities in solid mechanics (74G70)

Review text

This paper studies the interaction between a crack and a hole embedded in an infinite piezothermoelastic plate. A unifying solution based on Stroh's formalism and on the method of conformal mappings is presented for cracks and holes of various shapes induced by thermal loads such as uniform heat flow, point heat source, and temperature discontinuity. The unified stationary solution is given separately for thermal and piezoelectric fields within the theory of piezothermoelasticity in lieu of that of thermopiezoelectricity. As an application, the author solves numerically two examples restricted to the piezoelectric case (a piezoceramic plate with a crack and a square hole, and an infinite isotropic elastic plate containing a circle and a crack). The results are compared with results obtained by the finite element method, and are shown to agree with existing analytical results.

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• Green's function for thermopiezoelectric plates with holes of various shapes
• Some problems in plane thermopiezoelectric materials with holes
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• Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
• A new thermoelectroelastic solution for piezoelectric materials with various openings
• An exact and explicit treatment of an elliptic hole problem in thermopiezoelectric media
• Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids
• Upper and lower bounds analysis of electric induction intensity factors for multiple piezoelectric cracks by the BEM
• Analysis solution method for 3D planar crack problems of two-dimensional hexagonal quasicrystals with thermal effects
• The generalized two dimensional thermal-electro-elastic solution for the cracked-half-elliptical-hole problem in a half plane
• Hybrid fundamental solution based finite element method: theory and applications
• Closed-form solutions of an elliptical crack subjected to coupled phonon-phason loadings in two-dimensional hexagonal quasicrystal media
• Analysis of a crack in a finite thermopiezoelectric plate under heat flux

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