General solutions for thermopiezoelectrics with various holes under thermal loading

DOI10.1016/S0020-7683(99)00225-5MaRDI QIDQ1579965zbMATH OpenOpenAlexFDO

Authors Qing H. Qin

Publication date 28 November 2002

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/s0020-7683(99)00225-5

zbMATH Keywords

circlefractureintegral equationstationary solutionpoint heat sourceStroh's formalismmethod of conformal mappingsuniform heat flowtemperature discontinuitysquare holeinfinite piezothermoelastic plateinteraction between crack and hole

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Stress concentrations, singularities in solid mechanics (74G70)

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Cited in

(13)

• An exact and explicit treatment of an elliptic hole problem in thermopiezoelectric media
• Efficient hypersingular line and surface integrals direct evaluation by complex variable differentiation method
• Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids
• Hybrid fundamental solution based finite element method: theory and applications
• Analysis of a crack in a finite thermopiezoelectric plate under heat flux
• Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
• The generalized two dimensional thermal-electro-elastic solution for the cracked-half-elliptical-hole problem in a half plane
• Analysis solution method for 3D planar crack problems of two-dimensional hexagonal quasicrystals with thermal effects
• The general solution for a finite thermopiezoelectric plate containing a hole and a crack
• Thermoelastic analysis of a partially insulated crack in a strip under thermal impact loading using the hyperbolic heat conduction theory
• Upper and lower bounds analysis of electric induction intensity factors for multiple piezoelectric cracks by the BEM
• A new thermoelectroelastic solution for piezoelectric materials with various openings
• Closed-form solutions of an elliptical crack subjected to coupled phonon-phason loadings in two-dimensional hexagonal quasicrystal media

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