Analysis of a crack in a finite thermopiezoelectric plate under heat flux
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Publication:712309
DOI10.1007/S10704-005-5421-6zbMATH Open1197.74136OpenAlexW1990749344MaRDI QIDQ712309FDOQ712309
Authors: D. Kharzeev 
Publication date: 28 October 2010
Published in: International Journal of Fracture (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10704-005-5421-6
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Cites Work
Cited In (8)
- Dynamic 3D axisymmetric problems in continuously non-homogeneous piezoelectric solids
- Fracture analysis of Griffith interface crack in fine-grained piezoelectric coating/substrate under thermal loading
- Fracture analysis of a piezoelectric elliptical tube subject to internal pressure and thermal loadings
- An opening crack model for thermopiezoelectric solids
- The general solution for a finite thermopiezoelectric plate containing a hole and a crack
- Transient thermo-electro-elastic contact analysis of a sliding punch acting on a functionally graded piezoelectric strip under non-Fourier heat conduction
- Heat conduction and thermal stress induced by an electric current in an infinite thin plate containing an elliptical hole with an edge crack
- A closed crack tip model for interface cracks in thermopiezoelectric materials
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