An opening crack model for thermopiezoelectric solids
DOI10.1016/J.EUROMECHSOL.2013.03.004zbMATH Open1406.74507OpenAlexW2045010170WikidataQ105461034 ScholiaQ105461034MaRDI QIDQ1668359FDOQ1668359
Authors: Xianci Zhong, Ke-Shi Zhang 
Publication date: 3 September 2018
Published in: European Journal of Mechanics. A. Solids (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.euromechsol.2013.03.004
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Thermal effects in solid mechanics (74F05) Electromagnetic effects in solid mechanics (74F15) Control, switches and devices (``smart materials) in solid mechanics (74M05) Stress concentrations, singularities in solid mechanics (74G70)
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Cited In (8)
- Analysis of a crack in a finite thermopiezoelectric plate under heat flux
- Two collinear cracks under combined quadratic thermo-electro-elastic loading
- Analysis of thermal effects accompanying the interaction of electron beams with ferroelectric crystals
- Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
- A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface
- The thermo-dielectric medium crack model with penny shape in thermoelectric materials
- Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
- A closed crack tip model for interface cracks in thermopiezoelectric materials
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