Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor

DOI10.1016/J.ENGANABOUND.2021.06.013MaRDI QIDQ1980144zbMATH OpenOpenAlexFDO

Authors ChangHai Yang, Chunsheng Lu, MingHao Zhao, Qiaoyun Zhang

Publication date 3 September 2021

Published in Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.enganabound.2021.06.013

zbMATH Keywords

extended stress intensity factorspenny-shaped crackpiezoelectric semiconductorsemi-permeable boundary condition

Mathematics Subject Classification ID

Partial differential equations (35-XX) Mechanics of deformable solids (74-XX)

Recommendations

• Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
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Cites work

• 3D point force solution for a permeable penny-shaped crack embedded in an infinite transversely isotropic piezoelectric medium
• A mode III crack in a piezoelectric semiconductor of crystals with 6 mm symmetry
• An anti-plane crack in a piezoelectric semiconductor
• An opening crack model for thermopiezoelectric solids
• Analysis of cracked piezoelectric solids by a mixed three-dimensional BE approach
• Analysis of fractures in 3D piezoelectric media by a weakly singular integral equation method
• Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
• Finite-part integral and boundary element method to solve three-dimensional crack problems in piezoelectric materials
• General solution for transversely isotropic magneto-electro-thermo-elasticity and the potential theory method
• General solutions for coupled equations for piezoelectric media
• Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor
• Modeling of cracks in 3D piezoelectric finite media by weakly singular SGBEM
• Numerical simulation of crack growth in piezoelectric structures by BEM
• Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method
• Three-dimensional BEM for piezoelectric fracture analysis

Cited in

(4)

• Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor
• Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
• Free vibration of piezoelectric semiconductor composite structure with fractional viscoelastic layer
• Thickness size effect on fracture behavior of piezoelectric semiconductor strip

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