| Publication | Date of Publication | Type |
|---|
Three-dimensional interfacial analysis of an axisymmetric one-dimensional hexagonal graded quasicrystal film under thermal misfit
Applied Mathematical Modelling | 2026-09-15 | Paper |
Semi-analytical nonlinear analysis of laminated piezoelectric semiconductor structures via an iterative state-space method
Communications in Nonlinear Science and Numerical Simulation | 2026-09-10 | Paper |
Fracture analysis of 3D interface crack problems in two-dimensional hexagonal quasicrystal bi-materials. II: Numerical method
Applied Mathematical Modelling | 2026-08-28 | Paper |
Fracture analysis of 3D interface crack problems in two-dimensional hexagonal quasicrystal bi-materials. I: Theoretical formulations
Applied Mathematical Modelling | 2026-08-28 | Paper |
Interfacial analysis of a penny-shaped one-dimensional hexagonal functionally graded piezoelectric quasicrystal film on a temperature-dependent substrate
AMM. Applied Mathematics and Mechanics. (English Edition) | 2026-06-09 | Paper |
Exact solution of driving displacement for a partial PMP composite actuator and structural optimization
Acta Mechanica | 2026-04-29 | Paper |
Vibration characteristic analysis of a cracked piezoelectric semiconductor curved beam
AMM. Applied Mathematics and Mechanics. (English Edition) | 2026-02-25 | Paper |
On the interfacial behavior of a one-dimensional hexagonal piezoelectric quasicrystal film based on the beam theory
AMM. Applied Mathematics and Mechanics. (English Edition) | 2025-07-16 | Paper |
A meshfree Galerkin formulation for nonlinear piezoelectric semiconductors in consideration of flexoelectricity
Journal of Computational Physics | 2025-07-16 | Paper |
Natural frequency analysis of laminated piezoelectric beams with arbitrary polarization directions
AMM. Applied Mathematics and Mechanics. (English Edition) | 2025-02-20 | Paper |
Analytical solutions to mode I penny-shaped crack problems in two-dimensional hexagonal quasicrystals with piezoelectric effect
European Journal of Mechanics. A. Solids | 2024-10-21 | Paper |
Variational consistent one-point integration with Taylor's expansion-based stabilization in the second-order meshfree Galerkin method for strain gradient elasticity
Computer Methods in Applied Mechanics and Engineering | 2024-09-24 | Paper |
Equivalent single-layer Mindlin theory of laminated piezoelectric plates and application
ZAMM. Zeitschrift für Angewandte Mathematik und Mechanik | 2024-08-21 | Paper |
A modified first-order plate theory of laminated piezoelectric plate actuators
European Journal of Mechanics. A. Solids | 2024-03-14 | Paper |
A shooting method for nonlinear boundary value problems in a thermal piezoelectric semiconductor plate
ZAMM - Journal of Applied Mathematics and Mechanics / Zeitschrift für Angewandte Mathematik und Mechanik | 2024-03-05 | Paper |
Thermal-induced interfacial behavior of a thin one-dimensional hexagonal quasicrystal film
AMM. Applied Mathematics and Mechanics. (English Edition) | 2023-07-14 | Paper |
Interfacial fracture analysis for a two-dimensional decagonal quasi-crystal coating layer structure
AMM. Applied Mathematics and Mechanics. (English Edition) | 2022-08-18 | Paper |
Application of the homotopy analysis method to nonlinear characteristics of a piezoelectric semiconductor fiber
AMM. Applied Mathematics and Mechanics. (English Edition) | 2021-12-17 | Paper |
Analysis of anti-plane interface cracks in one-dimensional hexagonal quasicrystal coating
Applied Mathematical Modelling | 2021-09-21 | Paper |
Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
Engineering Analysis with Boundary Elements | 2021-09-03 | Paper |
A meshfree method with gradient smoothing for free vibration and buckling analysis of a strain gradient thin plate
Engineering Analysis with Boundary Elements | 2021-09-03 | Paper |
Oblivious DFA evaluation on joint input and its applications
Information Sciences | 2021-05-03 | Paper |
Secure extended wildcard pattern matching protocol from cut-and-choose oblivious transfer
Information Sciences | 2021-05-03 | Paper |
Enabling cloud storage auditing with key-exposure resilience under continual key-leakage
Information Sciences | 2021-03-31 | Paper |
Fundamental solutions and analysis of an interfacial crack in a one-dimensional hexagonal quasicrystal bi-material
Mathematics and Mechanics of Solids | 2020-11-11 | Paper |
| MZV evaluation of hypergeometric series | 2020-07-05 | Paper |
Consistent integration schemes for meshfree analysis of strain gradient elasticity
Computer Methods in Applied Mechanics and Engineering | 2020-05-12 | Paper |
Markov chain analysis of evolutionary algorithms on OneMax function -- from coupon collector's problem to (1 + 1) EA
Theoretical Computer Science | 2020-04-21 | Paper |
An efficient iteration approach for nonlinear boundary value problems in 2D piezoelectric semiconductors
Applied Mathematical Modelling | 2020-04-07 | Paper |
Analysis solution method for 3D planar crack problems of two-dimensional hexagonal quasicrystals with thermal effects
Applied Mathematical Modelling | 2020-04-06 | Paper |
Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. II: Numerical solutions
Applied Mathematical Modelling | 2020-02-12 | Paper |
Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. I: Theoretical solutions
Applied Mathematical Modelling | 2020-02-12 | Paper |
Nonlinear solutions of PN junctions of piezoelectric semiconductors
Acta Mechanica | 2020-01-08 | Paper |
| On logarithmic integrals, harmonic sums and variations | 2019-11-27 | Paper |
Closed-form solutions of an elliptical crack subjected to coupled phonon-phason loadings in two-dimensional hexagonal quasicrystal media
Mathematics and Mechanics of Solids | 2019-11-20 | Paper |
Analysis of elastic-plastic fracture in two-dimensional decagonal quasicrystals using the displacement discontinuity method
Engineering Analysis with Boundary Elements | 2019-11-07 | Paper |
Fundamental solutions and analysis of the interface crack for two-dimensional decagonal quasicrystal bimaterial via the displacement discontinuity method
Engineering Analysis with Boundary Elements | 2019-09-26 | Paper |
| Iterative boundary element method for cracks in a thermal medium with exact crack face boundary conditions | 2019-08-20 | Paper |
Improved integration scheme for the second-order consistent element-free Galerkin method
Engineering Analysis with Boundary Elements | 2018-12-18 | Paper |
Fundamental solutions of uniform loads over triangular elements in a three-dimensional piezoelectric medium
Applied Mathematical Modelling | 2018-12-17 | Paper |
Efficient and secure outsourced approximate pattern matching protocol
Soft Computing | 2018-10-22 | Paper |
Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors
European Journal of Mechanics. A. Solids | 2018-10-08 | Paper |
An iterative approach for analyzing cracks in two-dimensional piezoelectric media with exact boundary conditions
Engineering Analysis with Boundary Elements | 2018-08-13 | Paper |
Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor
Engineering Analysis with Boundary Elements | 2018-08-10 | Paper |
Displacement discontinuity analysis of a nonlinear interfacial crack in three-dimensional transversely isotropic magneto-electro-elastic bi-materials
Engineering Analysis with Boundary Elements | 2018-08-09 | Paper |
Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method
Engineering Analysis with Boundary Elements | 2018-08-09 | Paper |
Verifiable outsourced ciphertext-policy attribute-based encryption in cloud computing
Soft Computing | 2018-03-07 | Paper |
Three-dimensional extended displacement discontinuity method for vertical cracks in transversely isotropic piezoelectric media
Engineering Analysis with Boundary Elements | 2016-12-13 | Paper |
| scientific article; zbMATH DE number 6501113 (Why is no real title available?) | 2015-10-28 | Paper |
Nonlinear solution of the PS model for a semi-permeable crack in a 3D piezoelectric medium
Engineering Analysis with Boundary Elements | 2014-10-16 | Paper |
Extended displacement discontinuity method for nonlinear analysis of penny-shaped cracks in three-dimensional piezoelectric media
Engineering Analysis with Boundary Elements | 2014-05-26 | Paper |
Analysis of an arbitrarily oriented crack in a finite piezoelectric plane via the hybrid extended displacement discontinuity-fundamental solution method
Computational Mechanics | 2013-08-26 | Paper |
Solution method of interface cracks in three-dimensional transversely isotropic piezoelectric bimaterials
Engineering Analysis with Boundary Elements | 2012-08-07 | Paper |
Hybrid extended displacement discontinuity-charge simulation method for analysis of cracks in 2D piezoelectric media
Engineering Analysis with Boundary Elements | 2012-08-07 | Paper |
The strip dielectric breakdown model
International Journal of Fracture | 2010-10-12 | Paper |
Mechanics of shaft-loaded blister test for thin film suspended on compliant substrate
International Journal of Solids and Structures | 2010-10-12 | Paper |
Extended displacement discontinuity Green's functions for three-dimensional transversely isotropic magneto-electro-elastic media and applications
Engineering Analysis with Boundary Elements | 2010-09-28 | Paper |
Numerical solution of polarization saturation/dielectric breakdown model in 2D finite piezoelectric media
Journal of the Mechanics and Physics of Solids | 2010-07-20 | Paper |
Boundary integral equation method for conductive cracks in two and three-dimensional transversely isotropic piezoelectric media
Engineering Analysis with Boundary Elements | 2010-03-16 | Paper |
Numerical method of crack analysis in 2D finite magnetoelectroelastic media
Computational Mechanics | 2010-03-08 | Paper |
Strip electric-magnetic breakdown model in a magnetoelectroelastic medium
Journal of the Mechanics and Physics of Solids | 2009-10-01 | Paper |
Analysis method of planar interface cracks of arbitrary shape in three-dimensional transversely isotropic magnetoelectroelastic bimaterials
International Journal of Solids and Structures | 2009-04-23 | Paper |
Interfacial crack analysis in three-dimensional transversely isotropic bi-materials by boundary integral equation method
Applied Mathematics and Mechanics. (English Edition) | 2008-12-01 | Paper |
Analysis method of planar cracks of arbitrary shape in the isotropic plane of a three-dimensional transversely isotropic magnetoelectroelastic medium
International Journal of Solids and Structures | 2007-10-04 | Paper |
Boundary integral-differential equations and boundary element method for interfacial cracks in three-dimensional piezoelectric media
Engineering Analysis with Boundary Elements | 2005-08-05 | Paper |
The method of analysis of crack problem in three-dimensional non-local elasticity
Applied Mathematics and Mechanics. (English Edition) | 2001-11-28 | Paper |
The method of analysis of cracks in three-dimensional transversely isotropic media: Boundary intergral equation approach
Engineering Analysis with Boundary Elements | 2001-11-28 | Paper |
The analysis of crack problems with nonlocal elasticity
Applied Mathematics and Mechanics. (English Edition) | 2001-06-18 | Paper |
Dugdale model solutions for a penny-shaped crack in three-dimensional transversely isotropic piezoelectric media by boundary integral equation method
Engineering Analysis with Boundary Elements | 2001-05-10 | Paper |
