Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method

DOI10.1016/j.enganabound.2016.03.005zbMath1403.74266OpenAlexW2305434993MaRDI QIDQ1655061

Yang Yan, Ming-Hao Zhao, Cui Ying Fan, Yu'an Li

Publication date: 9 August 2018

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.enganabound.2016.03.005

zbMATH Keywords

boundary integral equationpenny-shaped crackintensity factorextended displacement discontinuity methodpiezoelectric semiconductorpiezoelectric-conductor iterative method (PCIM)

Mathematics Subject Classification ID

Brittle fracture (74R10) Boundary element methods applied to problems in solid mechanics (74S15) Electromagnetic effects in solid mechanics (74F15) Boundary element methods for boundary value problems involving PDEs (65N38)

Related Items

Iterative boundary element method for crack analysis of two-dimensional piezoelectric semiconductor, BEM analysis for curved cracks, Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings, Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor, Extended displacement discontinuity method for analysis of penny-shaped cracks in three-dimensional thermal piezoelectric semiconductors, Nonlinear solutions of PN junctions of piezoelectric semiconductors, A modified singular boundary method for three-dimensional high frequency acoustic wave problems, Analysis of arbitrarily shaped planar cracks in two-dimensional hexagonal quasicrystals with thermal effects. I: Theoretical solutions, Extension of a piezoelectric semiconductor fiber with consideration of electrical nonlinearity

Cites Work

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