Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings

DOI10.1016/J.ENGANABOUND.2020.09.016MaRDI QIDQ2223897zbMATH OpenOpenAlexFDO

Authors Hao Chai, Yumei Bao, Zheng Zhang

Publication date 3 February 2021

Published in Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.enganabound.2020.09.016

zbMATH Keywords

axisymmetric loadingshypersingular integral equationsinterface circular crackstress intensity factors

Mathematics Subject Classification ID

Systems of nonsingular linear integral equations (45F05) Numerical methods for integral equations (65R20) Brittle fracture (74R10) Numerical and other methods in solid mechanics (74S99)

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Cites work

• A BEM analysis of a penny-shaped interface crack using the open and the frictionless contact models: range of validity of various asymptotic solutions
• A new variable-order singular boundary element for calculating stress intensity factors in three-dimensional elasticity problems
• Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
• Analysis of stress intensity factors of a ring-shaped interface crack.
• Applications of finite-part integrals to the singular integral equations of crack problems in plane and three-dimensional elasticity
• Boundary element analysis of the stress intensity factors of plane interface cracks between dissimilarly adjoined anisotropic materials
• Boundary element method for J-integral and stress intensity factor computations in three-dimensional interface cracks
• Displacement discontinuity analysis of a nonlinear interfacial crack in three-dimensional transversely isotropic magneto-electro-elastic bi-materials
• Domain integral formulation for stress intensity factor computation along curved three-dimensional interface cracks
• Domain integrals for axisymmetric interface crack problems
• Hybrid boundary element analysis for surface cracks
• Hypersingular integrals in boundary element fracture analysis
• Influence of geometry and material on the stress intensity of an interfacial crack propagating from a bi-material notch
• Mixed Mode Cracking in Layered Materials
• Singularity analysis of planar cracks in three-dimensional piezoelectric semiconductors via extended displacement discontinuity boundary integral equation method
• Stress intensity factor analyses of three-dimensional interface cracks using tetrahedral finite elements
• Stress intensity factor analysis of interface cracks using X-FEM
• The effect of internal pressure on a penny-shaped crack at the interface of two bonded dissimilar elastic half-spaces
• The interface penny-shaped crack reconsidered
• THE PENNY-SHAPED CRACK ON AN INTERFACE
• Theoretical analysis of three-dimensional interface crack

Cited in

(4)

• scientific article; zbMATH DE number 5158656 (Why is no real title available?)
• scientific article; zbMATH DE number 5584017 (Why is no real title available?)
• Numerical solution of a singular integral equation arising in a cruciform crack problem
• Effect of Mechanical Loadings on Two Unequal Slanted Cracks Length in Bi-Materials Plate

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