Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
DOI10.1007/S10704-009-9348-1zbMath1273.74112OpenAlexW1998408691MaRDI QIDQ373408
Publication date: 22 October 2013
Published in: International Journal of Fracture (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10704-009-9348-1
contactinterface fracturecomplex stress intensity factorelectronic packageinner pressurethree-dimensional cracksvirtual crack closure technique
Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70) Finite element methods applied to problems in solid mechanics (74S05)
Related Items (3)
Cites Work
- Obtaining mode mixity for a bimaterial interface crack using the virtual crack closure technique
- Analysis of three-dimensional interface cracks using enriched finite element
- The use of finite extension strain energy release rates in fracture of interfacial cracks
- Finite element calculation of stress intensity factors for interfacial crack using virtual crack closure integral
- The Interface Crack Under Combined Loading
- Stress intensity factors for three-dimensional surface cracks using enriched finite elements
- Generalization of the grippith-sneddon criterion for the case of a nonhomogeneous body
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