Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

DOI10.1007/s10704-009-9348-1zbMath1273.74112MaRDI QIDQ373408

Mohammad Hasan, H. S. Yoon

Publication date: 22 October 2013

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-009-9348-1

zbMATH Keywords

contact; interface fracture; complex stress intensity factor; electronic package; inner pressure; three-dimensional cracks; virtual crack closure technique

Mathematics Subject Classification ID

74R10: Brittle fracture

74G70: Stress concentrations, singularities in solid mechanics

74S05: Finite element methods applied to problems in solid mechanics