Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

DOI10.1007/S10704-009-9348-1zbMATH Open1273.74112OpenAlexW1998408691MaRDI QIDQ373408FDOQ373408

Authors: T.-C. Chiu, H.-C. Lin 

Publication date: 22 October 2013

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-009-9348-1

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zbMATH Keywords

contactinterface fracturecomplex stress intensity factorelectronic packageinner pressurethree-dimensional cracksvirtual crack closure technique

Mathematics Subject Classification ID

Brittle fracture (74R10) Finite element methods applied to problems in solid mechanics (74S05) Stress concentrations, singularities in solid mechanics (74G70)

Cites Work

• The use of finite extension strain energy release rates in fracture of interfacial cracks
• The Interface Crack Under Combined Loading
• Finite element calculation of stress intensity factors for interfacial crack using virtual crack closure integral
• Stress intensity factors for three-dimensional surface cracks using enriched finite elements
• Generalization of the grippith-sneddon criterion for the case of a nonhomogeneous body
• Obtaining mode mixity for a bimaterial interface crack using the virtual crack closure technique
• Analysis of three-dimensional interface cracks using enriched finite element

Cited In (5)

• Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings
• Analysis of fatigue delamination growth in flip-chip package
• Title not available (Why is that?)
• Analysis of three-dimensional interface cracks using enriched finite element
• Elastic interaction of interfacial spherical-cap cracks in hollow particle filled composites

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