Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique

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Publication:373408

DOI10.1007/S10704-009-9348-1zbMath1273.74112OpenAlexW1998408691MaRDI QIDQ373408

Mohammad Hasan, H. S. Yoon

Publication date: 22 October 2013

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10704-009-9348-1




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