Stress intensity factor analyses of three-dimensional interface cracks using tetrahedral finite elements
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Cites work
- scientific article; zbMATH DE number 3696545 (Why is no real title available?)
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- A three-dimensional meshfree method for continuous multiple-crack initiation, propagation and junction in statics and dynamics
- A virtual crack closure-integral method (VCCM) for three-dimensional crack problems using linear tetrahedral finite elements
- An extended finite element library
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- Surfaces Generated by Moving Least Squares Methods
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Cited in
(9)- Mixed-mode stress intensity factors of a three-dimensional crack in a bonded bimaterial
- Numerical solutions of hypersingular integral equations for interface circular crack under axisymmetric loadings
- A stable discontinuity-enriched finite element method for 3-D problems containing weak and strong discontinuities
- Evaluation of the T-stress and stress intensity factor for multi-crack problem using spline fictitious boundary element alternating method
- Stress intensity factors for three-dimensional cracks in functionally graded materials using enriched finite elements
- Boundary element method for \(J\)-integral and stress intensity factor computations in three-dimensional interface cracks
- scientific article; zbMATH DE number 2135645 (Why is no real title available?)
- Analysis of stress intensity factors for three-dimensional interface crack problems in electronic packages using the virtual crack closure technique
- Analysis of three-dimensional interface cracks using enriched finite element
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