Boundary integral equation method for conductive cracks in two and three-dimensional transversely isotropic piezoelectric media
DOI10.1016/J.ENGANABOUND.2005.02.004zbMATH Open1182.74245OpenAlexW2093735038MaRDI QIDQ2269248FDOQ2269248
Authors: Feng Yang, Tong Liu, Min-Shan Liu, MingHao Zhao
Publication date: 16 March 2010
Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.enganabound.2005.02.004
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Cites Work
- Contact Mechanics
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- Conducting cracks in a piezoelectric ceramic of limited electrical polarization
- BEM for crack-inclusion problems of plane thermopiezoelectric solids
- On the Green's functions for two-phase transversely isotropic piezoelectric media
- A BEM analysis of fracture mechanics in 2D anisotropic piezoelectric solids.
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- Three‐dimensional singularities of elastic fields near vertices
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- Finite-part integrals in problems of three-dimensional cracks
- Piezoelectric solid with an elliptic inclusion or hole
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- Remarks on the Gaussian quadrature rule for finite-part integrals with a second-order singularity
Cited In (8)
- Elliptical crack and punch problems solved by integral equation method for piezoelectric media
- Finite-part integral and boundary element method to solve three-dimensional crack problems in piezoelectric materials
- Dugdale model solutions for a penny-shaped crack in three-dimensional transversely isotropic piezoelectric media by boundary integral equation method
- Three-dimensional extended displacement discontinuity method for vertical cracks in transversely isotropic piezoelectric media
- The method of analysis of cracks in three-dimensional transversely isotropic media: Boundary intergral equation approach
- Electromechanical behaviour of a finite piezoelectric layer under a flat punch
- Hybrid extended displacement discontinuity-charge simulation method for analysis of cracks in 2D piezoelectric media
- Boundary integral-differential equations and boundary element method for interfacial cracks in three-dimensional piezoelectric media
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