Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (Q1980144)

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Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor
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    Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (English)
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    3 September 2021
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    piezoelectric semiconductor
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    penny-shaped crack
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    semi-permeable boundary condition
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    extended stress intensity factors
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