Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (Q1980144)
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scientific article; zbMATH DE number 7390967
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| English | Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor |
scientific article; zbMATH DE number 7390967 |
Statements
Analysis of a penny-shaped crack with semi-permeable boundary conditions across crack face in a 3D thermal piezoelectric semiconductor (English)
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3 September 2021
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piezoelectric semiconductor
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penny-shaped crack
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semi-permeable boundary condition
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extended stress intensity factors
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0.8918763399124146
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0.8126177787780762
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0.8101826906204224
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0.806323230266571
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