Analysis of three-dimensional ellipsoidal inclusions in thermoelectric solids
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Publication:2003135
DOI10.1016/J.IJENGSCI.2019.06.005zbMATH Open1425.74183OpenAlexW2951294741WikidataQ127678564 ScholiaQ127678564MaRDI QIDQ2003135FDOQ2003135
Authors: Yanyan Li 
Publication date: 15 July 2019
Published in: International Journal of Engineering Science (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijengsci.2019.06.005
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Green's function methodthermoelectric materialseffective material propertiesthree-dimensional ellipsoidal inclusion
Cites Work
- The determination of the elastic field of an ellipsoidal inclusion, and related problems
- Plane problems in piezoelectric media with defects
- General solutions for thermopiezoelectrics with various holes under thermal loading
- Three-dimensional analysis of an ellipsoidal inclusion in a piezoelectric material
- A continuum theory of thermoelectric bodies and effective properties of thermoelectric composites
- Finite element analysis of nonlinear fully coupled thermoelectric materials
- An exact solution of crack problems in piezoelectric materials
- Thermoelectric fields and associated thermal stresses for an inclined elliptic hole in thermoelectric materials
Cited In (11)
- Neutral coated spheres in nonlinear thermoelectricity
- Thermoelectric field for a coated hole of arbitrary shape in a nonlinearly coupled thermoelectric material
- A three-phase elliptical inhomogeneity in nonlinearly coupled thermoelectric materials
- Continuous contact problem of interaction between two arbitrarily positioned flat stamps on the thermoelectric material
- Finite element analysis of nonlinear fully coupled thermoelectric materials
- Electric-current-induced thermal stress around a non-circular rigid inclusion in a two-dimensional nonlinear thermoelectric material
- Modeling thermoelectric effects in piezoelectric semiconductors: new fully coupled mechanisms for mechanically manipulated heat flux and refrigeration
- Thermomechanical modeling of functionally graded materials based on bimaterial fundamental solutions
- Multiple rigid line inclusions (anti-cracks) in a multilayered orthotropic medium under anti-plane loading
- Electronic and thermoelectric properties of pure and alloys In\(_{2}\)O\(_{3}\) transparent conductors
- The effectiveness of the bonding layer to attain reliable thermoelectric structures
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