A numerical model of stress driven grain boundary diffusion. (Q1418699): Difference between revisions

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+A numerical study of electro-migration voiding by evolving level set functions on a fixed Cartesian grid
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+Computation for electromigration in interconnects of microelectronic devices
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+Analysis of Stress-Driven Grain Boundary Diffusion. Part I
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+First-Order System Least Squares for Second-Order Partial Differential Equations: Part II
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