Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction (Q2245879): Difference between revisions

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Property / author: Lin-Lin Wang / rank
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Property / full work available at URL: https://doi.org/10.1016/j.apm.2020.09.005 / rank
 
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Latest revision as of 05:12, 27 July 2024

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Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction
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    Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction (English)
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    15 November 2021
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    damping modeling
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    three-dimensional heat conduction
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    Kirchhoff-Love microplate
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    thermoelastic
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