Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (Q2056570): Difference between revisions

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Revision as of 10:16, 27 July 2024

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Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
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    Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (English)
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    8 December 2021
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    stress intensity factor
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    thermally insulated cracks
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    bonded dissimilar materials
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    hypersingular integral equation
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