Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
DOI10.1016/J.APM.2020.09.054zbMATH Open1481.74660OpenAlexW3092458453WikidataQ112880202 ScholiaQ112880202MaRDI QIDQ2056570FDOQ2056570
Authors: K. B. Hamzah, N. Senu, Nik Mohd Asri Nik Long, Zainidin K. Eshkuvatov 
Publication date: 8 December 2021
Published in: Applied Mathematical Modelling (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.apm.2020.09.054
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hypersingular integral equationstress intensity factorbonded dissimilar materialsthermally insulated cracks
Thermal effects in solid mechanics (74F05) Brittle fracture (74R10) Systems of singular linear integral equations (45F15)
Cites Work
- Numerical evaluation of hypersingular integrals
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- An internal crack parallel to the boundary of a nonhomogeneous half plane under thermal loading
- Thermoelastic Fracture Mechanics for Nonhomogeneous Material Subjected to Unsteady Thermal Load
- Derivation of a new analytical solution for a general two‐dimensional finite‐part integral applicable in fracture mechanics
- Numerical solution of three-dimensional crack problem by using hypersingular integral equation
- Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
- Hypersingular integral equation for multiple curved cracks problem in plane elasticity
- A thermoelastic problem for a crack between dissimilar anisotropic media
Cited In (5)
- On a symplectic analytical singular element for cracks under thermal shock considering heat flux singularity
- Stress intensity factor for bonded dissimilar materials weakened by multiple cracks
- Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
- Stress intensity factor for multiple cracks in bonded dissimilar materials using hypersingular integral equations
- Approximate structures of thermoelastic fields induced by a penny-shaped thermal-medium crack in a transversely isotropic layer
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