Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations

DOI10.1016/J.APM.2020.09.054MaRDI QIDQ2056570zbMATH OpenOpenAlexWikidataFDO

Authors K. B. Hamzah, N. Senu, Nik Mohd Asri Nik Long, Zainidin K. Eshkuvatov

Publication date 8 December 2021

Published in Applied Mathematical Modelling (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.apm.2020.09.054

zbMATH Keywords

hypersingular integral equationstress intensity factorbonded dissimilar materialsthermally insulated cracks

Mathematics Subject Classification ID

Thermal effects in solid mechanics (74F05) Brittle fracture (74R10) Systems of singular linear integral equations (45F15)

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Cites work

• scientific article; zbMATH DE number 2022321 (Why is no real title available?)
• scientific article; zbMATH DE number 1862742 (Why is no real title available?)
• scientific article; zbMATH DE number 3084088 (Why is no real title available?)
• A thermoelastic problem for a crack between dissimilar anisotropic media
• An internal crack parallel to the boundary of a nonhomogeneous half plane under thermal loading
• Derivation of a new analytical solution for a general two‐dimensional finite‐part integral applicable in fracture mechanics
• Hypersingular integral equation for multiple curved cracks problem in plane elasticity
• Numerical evaluation of hypersingular integrals
• Numerical solution of three-dimensional crack problem by using hypersingular integral equation
• Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
• Thermoelastic Fracture Mechanics for Nonhomogeneous Material Subjected to Unsteady Thermal Load

Cited in

(5)

• On a symplectic analytical singular element for cracks under thermal shock considering heat flux singularity
• Stress intensity factor for bonded dissimilar materials weakened by multiple cracks
• Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
• Stress intensity factor for multiple cracks in bonded dissimilar materials using hypersingular integral equations
• Approximate structures of thermoelastic fields induced by a penny-shaped thermal-medium crack in a transversely isotropic layer

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