Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (Q2056570)
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scientific article; zbMATH DE number 7440451
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| English | Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations |
scientific article; zbMATH DE number 7440451 |
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Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations (English)
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8 December 2021
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stress intensity factor
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thermally insulated cracks
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bonded dissimilar materials
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hypersingular integral equation
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0.8708567023277283
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0.864690899848938
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0.8496255278587341
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0.7912057638168335
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