Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016): Difference between revisions
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| Property / DOI: 10.1007/s10409-008-0192-8 / rank | |||
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| Property / Wikidata QID: Q61503383 / rank | |||
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| Property / cites work: Mechanics of Smart-Cut technology / rank | |||
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| Property / cites work: Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent / rank | |||
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| Property / cites work: Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts / rank | |||
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| Property / DOI: 10.1007/S10409-008-0192-8 / rank | |||
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Latest revision as of 15:24, 9 December 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction |
scientific article |
Statements
Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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20 August 2013
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smart-cut technology
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silicon-on-insulator wafer
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crack growth
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fracture mechanics
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stress intensity factor
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