Fracture mechanics analysis on smart-cut^ technology. I: Effects of stiffening wafer and defect interaction

DOI10.1007/S10409-008-0192-8zbMATH Open1270.74175OpenAlexW2060411367WikidataQ61503383 ScholiaQ61503383MaRDI QIDQ362016FDOQ362016

Wenyu Shou, Bin Gu, Hongyuan Liu, Qiaofeng Xi, Yiu-Wing Mai

Publication date: 20 August 2013

Published in: Acta Mechanica Sinica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s10409-008-0192-8

zbMATH Keywords

fracture mechanicsstress intensity factorcrack growthsilicon-on-insulator wafersmart-cut technology

Mathematics Subject Classification ID

Brittle fracture (74R10) Stress concentrations, singularities in solid mechanics (74G70)

Cites Work

• Mechanics of Smart-Cut technology
• Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts
• Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent

Cited In (2)

• Fracture mechanics analysis on smart-cut\(^\circledR\) technology. II: Effect of bonding flaws
• Penny-shaped interfacial crack between dissimilar magnetoelectroelastic layers

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