Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction
From MaRDI portal
Publication:362016
DOI10.1007/S10409-008-0192-8zbMath1270.74175OpenAlexW2060411367WikidataQ61503383 ScholiaQ61503383MaRDI QIDQ362016
Wenyu Shou, Bin Gu, Hongyuan Liu, Qiaofeng Xi, Yiu-Wing Mai
Publication date: 20 August 2013
Published in: Acta Mechanica Sinica (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s10409-008-0192-8
Related Items (1)
Cites Work
This page was built for publication: Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction