Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016)

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Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction
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    Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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    20 August 2013
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    smart-cut technology
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    silicon-on-insulator wafer
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    crack growth
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    fracture mechanics
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    stress intensity factor
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