Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016)
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scientific article; zbMATH DE number 6199542
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| English | Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction |
scientific article; zbMATH DE number 6199542 |
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Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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20 August 2013
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smart-cut technology
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silicon-on-insulator wafer
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crack growth
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fracture mechanics
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stress intensity factor
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0.91731066
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0.7868346
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0.78583205
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0.7850828
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0.7848638
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0.7824912
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