A microsystem for the fracture characterization of polysilicon at the micro-scale

DOI10.1016/J.EUROMECHSOL.2010.09.006MaRDI QIDQ1949073zbMATH OpenOpenAlexFDO

Authors Alberto Corigliano, Giacomo Langfelder, A. Longoni, F. Zaraga, A. Merassi, Aldo Ghisi

Publication date 25 April 2013

Published in European Journal of Mechanics. A. Solids (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.euromechsol.2010.09.006

zbMATH Keywords

cohesive crack simulationmechanical testingmicrosystempolysilicon fracture

Mathematics Subject Classification ID

Experimental work for problems pertaining to mechanics of deformable solids (74-05) Brittle fracture (74R10) Finite element methods applied to problems in solid mechanics (74S05)

Recommendations

• Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon
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Cites work

• Computational modelling of impact damage in brittle materials
• Fracture Toughness and Subcritical Crack Growth in Polycrystalline Silicon
• From crack deflection to lattice vibrations--macro to atomistic examination of dynamic cleavage fracture
• scientific article; zbMATH DE number 3130180 (Why is no real title available?)

Cited in

(10)

• The effects of different boundary conditions on three-dimensional cracked discs under anti-plane loading
• Predictions of strength in MEMS components with defects --- a novel experimental--theoretical approach
• Analytical description of fracture features in single crystal silicon
• Modeling elasticity of cubic crystals using a novel nonlocal lattice particle method
• Fracture of solar-grade anisotropic polycrystalline silicon: a combined phase field-cohesive zone model approach
• Fracture mechanics analysis on smart-cut^ technology. I: Effects of stiffening wafer and defect interaction
• Foreword: Micro- or nano-mechanics
• Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon
• On-chip electrostatically actuated bending tests for the mechanical characterization of polysilicon at the micro scale
• Nanoscale damage during fracture in silica glass

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