Multiscale modelling framework for the fracture of thin brittle polycrystalline films: application to polysilicon
DOI10.1007/S00466-014-1083-4zbMATH Open1311.74105OpenAlexW2054824525MaRDI QIDQ487915FDOQ487915
Authors: Shantanu S. Mulay, Gauthier Becker, Renaud Vayrette, Jean-Pierre Raskin, T. Pardoen, Montserrat Galceran, Stéphane Godet, Ludovic Noels 
Publication date: 23 January 2015
Published in: Computational Mechanics (Search for Journal in Brave)
Full work available at URL: http://hdl.handle.net/1721.1/104882
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Cites Work
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Cited In (9)
- Propagation of material and surface profile uncertainties on MEMS micro-resonators using a stochastic second-order computational multi-scale approach
- Predictions of strength in MEMS components with defects --- a novel experimental--theoretical approach
- A microsystem for the fracture characterization of polysilicon at the micro-scale
- Fracture of solar-grade anisotropic polycrystalline silicon: a combined phase field-cohesive zone model approach
- A multi-scale simulation of tungsten film delamination from silicon substrate
- A domain decomposition approach for the simulation of fracture phenomena in polycrystalline microsystems
- Monte Carlo simulation of micro-cracking in polysilicon MEMS exposed to shocks
- A stochastic computational multiscale approach; application to MEMS resonators
- Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction
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