Mechanics of Smart-Cut technology

DOI10.1016/J.IJSOLSTR.2004.02.054MaRDI QIDQ1781473zbMATH OpenOpenAlexFDO

Authors Xiqiao Feng, Yonggang Huang

Publication date 27 June 2005

Published in International Journal of Solids and Structures (Search for Journal in Brave)

Full work available at URL https://doi.org/10.1016/j.ijsolstr.2004.02.054

zbMATH Keywords

Analytic solutionChemo-mechanical processCrackDebondingFractureMicro-mechanicsSemiconductor materialStress intensity factor

Mathematics Subject Classification ID

Chemical structure in solid mechanics (74E40) Stress concentrations, singularities in solid mechanics (74G70) Micromechanics of solids (74M25)

Recommendations

• Mechanics of composite-polymer-materials laser cutting
• Dynamic analysis of a cutting mechanism.
• Complex dynamics in metal cutting
• Peculiarities of behavior of materials under tool cutting
• Fracture mechanics analysis on smart-cut^ technology. II: Effect of bonding flaws
• Metal cutting theory. New perspectives and new approaches
• Dynamic management of cutting tools for flexible and quality machining

Cited in

(2)

• Fracture mechanics analysis on smart-cut^ technology. II: Effect of bonding flaws
• Fracture mechanics analysis on smart-cut^ technology. I: Effects of stiffening wafer and defect interaction

This page was built for publication: Mechanics of Smart-Cut technology

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q1781473)