Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016): Difference between revisions
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Property / DOI: 10.1007/s10409-008-0192-8 / rank | |||
Property / author | |||
Property / author: Yiu-Wing Mai / rank | |||
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Property / author: Yiu-Wing Mai / rank | |||
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Property / Mathematics Subject Classification ID: 74R10 / rank | |||
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Property / Mathematics Subject Classification ID: 74G70 / rank | |||
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Property / zbMATH DE Number: 6199542 / rank | |||
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smart-cut technology | |||
Property / zbMATH Keywords: smart-cut technology / rank | |||
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silicon-on-insulator wafer | |||
Property / zbMATH Keywords: silicon-on-insulator wafer / rank | |||
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crack growth | |||
Property / zbMATH Keywords: crack growth / rank | |||
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fracture mechanics | |||
Property / zbMATH Keywords: fracture mechanics / rank | |||
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stress intensity factor | |||
Property / zbMATH Keywords: stress intensity factor / rank | |||
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Property / MaRDI profile type: MaRDI publication profile / rank | |||
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Property / full work available at URL: https://doi.org/10.1007/s10409-008-0192-8 / rank | |||
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Property / OpenAlex ID: W2060411367 / rank | |||
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Property / Wikidata QID: Q61503383 / rank | |||
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Property / cites work | |||
Property / cites work: Mechanics of Smart-Cut technology / rank | |||
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Property / cites work: Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent / rank | |||
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Property / cites work: Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts / rank | |||
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Property / DOI: 10.1007/S10409-008-0192-8 / rank | |||
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Latest revision as of 15:24, 9 December 2024
scientific article
Language | Label | Description | Also known as |
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English | Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction |
scientific article |
Statements
Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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20 August 2013
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smart-cut technology
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silicon-on-insulator wafer
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crack growth
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fracture mechanics
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stress intensity factor
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