Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (Q362016): Difference between revisions

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Property / DOI: 10.1007/s10409-008-0192-8 / rank
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Property / author
 
Property / author: Yiu-Wing Mai / rank
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Property / author
 
Property / author: Yiu-Wing Mai / rank
 
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Property / Mathematics Subject Classification ID
 
Property / Mathematics Subject Classification ID: 74R10 / rank
 
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Property / Mathematics Subject Classification ID
 
Property / Mathematics Subject Classification ID: 74G70 / rank
 
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Property / zbMATH DE Number
 
Property / zbMATH DE Number: 6199542 / rank
 
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Property / zbMATH Keywords
 
smart-cut technology
Property / zbMATH Keywords: smart-cut technology / rank
 
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Property / zbMATH Keywords
 
silicon-on-insulator wafer
Property / zbMATH Keywords: silicon-on-insulator wafer / rank
 
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crack growth
Property / zbMATH Keywords: crack growth / rank
 
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fracture mechanics
Property / zbMATH Keywords: fracture mechanics / rank
 
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stress intensity factor
Property / zbMATH Keywords: stress intensity factor / rank
 
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Property / MaRDI profile type: MaRDI publication profile / rank
 
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Property / full work available at URL: https://doi.org/10.1007/s10409-008-0192-8 / rank
 
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Property / OpenAlex ID
 
Property / OpenAlex ID: W2060411367 / rank
 
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Property / Wikidata QID
 
Property / Wikidata QID: Q61503383 / rank
 
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Property / cites work
 
Property / cites work: Mechanics of Smart-Cut technology / rank
 
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Property / cites work
 
Property / cites work: Exact solution of plane isolated crack normal to a bimaterial interface of infinite extent / rank
 
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Property / cites work
 
Property / cites work: Transient response of an interface crack between dissimilar piezoelectric layers under mechanical impacts / rank
 
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Property / DOI
 
Property / DOI: 10.1007/S10409-008-0192-8 / rank
 
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links / mardi / namelinks / mardi / name
 

Latest revision as of 15:24, 9 December 2024

scientific article
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English
Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction
scientific article

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    Fracture mechanics analysis on smart-cut\(^\circledR\) technology. I: Effects of stiffening wafer and defect interaction (English)
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    20 August 2013
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    smart-cut technology
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    silicon-on-insulator wafer
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    crack growth
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    fracture mechanics
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    stress intensity factor
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