Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components (Q1001042): Difference between revisions

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+MaRDI publication profile
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+Normal rank
@@ Property / full work available at URL @@
+https://doi.org/10.1016/j.ijheatmasstransfer.2008.04.071
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+W2147462343
@@ Property / OpenAlex ID: W2147462343 / rank @@
+Normal rank
@@ Property / cites work @@
+Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components
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+Q2717244
@@ Property / cites work: Q2717244 / rank @@
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+A quasi-3D analysis of the thermal performance of a flat heat pipe
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+Q3999651
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+Recent advances in the numerical analysis of heat pipes
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