Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials (Q1276180): Difference between revisions
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Latest revision as of 21:14, 19 March 2024
scientific article
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English | Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials |
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Thermoelectroelastic Green's function and its application for bimaterial of piezoelectric materials (English)
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23 September 1999
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The authors derive the thermoelectroelastic Green's functions for bimaterials subjected to a temperature discontinuity using Stroh formalism. The obtained results are used to solve the problem of a crack of arbitrary orientation near the bimaterial interface. This problem is reduced to the solution of a system of singular integral equations for the unknown temperature discontinuity defined on the crack faces. Numerical evaluation yields stress and electric displacement intensity factors and an estimate for the direction of crack growth. An example is solved to illustrate the proposed formulation.
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thermal stress
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stress intensity factor
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electric displacement
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Stroh formalism
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system of singular integral equations
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temperature discontinuity
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direction of crack growth
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