Stress intensity factors for bonded two half planes weakened by thermally insulated cracks (Q828231): Difference between revisions

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+An arc-shaped crack in nonlinear fully coupled thermoelectric materials
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+Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
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+An internal crack parallel to the boundary of a nonhomogeneous half plane under thermal loading
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+Numerical solution for thermal confocal elliptic dissimilar layers in plane elasticity
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+Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium
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+Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source
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+Solution of problem of two dissimilar materials bonded at one interface subjected to temperature
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+Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer
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+Thermoelastic Fracture Mechanics for Nonhomogeneous Material Subjected to Unsteady Thermal Load
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+Q5822969
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+Hypersingular integral equation for multiple curved cracks problem in plane elasticity
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+Stress intensity factor for multiple cracks in bonded dissimilar materials using hypersingular integral equations
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+Q4441706
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+Q4791752
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+Numerical evaluation of hypersingular integrals
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+Derivation of a new analytical solution for a general two‐dimensional finite‐part integral applicable in fracture mechanics
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+Stress intensity factor for an elastic half plane weakened by multiple curved cracks
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