Stress intensity factors for bonded two half planes weakened by thermally insulated cracks

DOI10.1007/S00707-020-02753-0zbMATH Open1451.74034OpenAlexW3043059041MaRDI QIDQ828231FDOQ828231

Authors: K. B. Hamzah, Nik Mohd Asri Nik Long, N. Senu, Zainidin K. Eshkuvatov 

Publication date: 8 January 2021

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-020-02753-0

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Mathematics Subject Classification ID

Theories of fracture and damage (74A45) Thermal effects in solid mechanics (74F05) Stress (74A10)

Cites Work

• Numerical evaluation of hypersingular integrals
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• Numerical solution for thermal confocal elliptic dissimilar layers in plane elasticity
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• An internal crack parallel to the boundary of a nonhomogeneous half plane under thermal loading
• Thermoelastic Fracture Mechanics for Nonhomogeneous Material Subjected to Unsteady Thermal Load
• Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer
• Derivation of a new analytical solution for a general two‐dimensional finite‐part integral applicable in fracture mechanics
• Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source
• Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium
• An arc-shaped crack in nonlinear fully coupled thermoelectric materials
• Thermal stress analysis of orthotropic plate containing a rectangular hole using complex variable method
• Stress intensity factor for multiple cracks in bonded dissimilar materials using hypersingular integral equations
• Stress intensity factor for an elastic half plane weakened by multiple curved cracks
• Solution of problem of two dissimilar materials bonded at one interface subjected to temperature
• Hypersingular integral equation for multiple curved cracks problem in plane elasticity

Cited In (3)

• Numerical solution for the thermally insulated cracks in bonded dissimilar materials using hypersingular integral equations
• Stress intensity factor for bonded dissimilar materials weakened by multiple cracks
• Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes

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