Solution of problem of two dissimilar materials bonded at one interface subjected to temperature

DOI10.1007/s00419-014-0840-3zbMath1338.74023OpenAlexW1991786414MaRDI QIDQ2511664

Seiji Kato, Norio Hasebe

Publication date: 6 August 2014

Published in: Archive of Applied Mechanics (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00419-014-0840-3

zbMATH Keywords

stripcomplex variable methodinterfacetemperaturemapping functiondebondingbondeddissimilar bimaterialDundurs' parameter

Mathematics Subject Classification ID

Inhomogeneity in solid mechanics (74E05) Thermal effects in solid mechanics (74F05) Complex-variable methods applied to problems in solid mechanics (74S70)

Related Items (3)

Stress intensity factors for bonded two half planes weakened by thermally insulated cracks ⋮ Debonding fracture of bonded bimaterial semi‐strips subjected to concentrated forces and couples ⋮ Solution of bonded bimaterial problem of two interfaces subjected to concentrated forces and couples

Cites Work

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• The plane solution for bending of joined dissimilar elastic semi-infinite strips
• Stress singularities in a bimaterial joint with inhomogeneous temperature distribution
• Debondings at a Semielliptic Rigid Inclusion on the Rim of a Half Plane
• Stress analysis of a semi-infinite plate with an oblique edge crack
• A Semi-Infinite Elastic Strip Bonded to an Infinite Strip
• Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface
• Stress Analysis for Bonded Layers
• The Plane Solution for Joined Dissimilar Elastic Semistrips Under Tension
• Stress analysis for a strip with semi-elliptical notches or cracks on both sides by means of rational mapping function
• The Elastic Strip Under Mixed Boundary Conditions

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