Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface
From MaRDI portal
Publication:4021925
DOI10.1115/1.2899467zbMath0825.73435OpenAlexW2006486816MaRDI QIDQ4021925
Takuji Nakamura, M. Okumura, Norio Hasebe
Publication date: 17 January 1993
Published in: Journal of Applied Mechanics (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1115/1.2899467
Related Items
Hypersingular integral equation approach for plane elasticity crack problem with circular boundary ⋮ Solution of problem of two dissimilar materials bonded at one interface subjected to temperature ⋮ Anti-plane shear stress problem of two bonded dissimilar half-spaces with an elliptical hole or rigid inclusion on the interface
This page was built for publication: Bonded Bi-material Half-Planes With Semi-elliptical Notch Under Tension Along the Interface