scientific article; zbMATH DE number 94005

zbMATH Open0757.73040MaRDI QIDQ4019845FDOQ4019845

Authors: A. P. Dwivedi, Sarita Pandey, D. N. Tiwari 

Publication date: 16 January 1993

Title of this publication is not available (Why is that?)

Recommendations

• Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes
• Thermal stresses around a crack in the nonhomogeneous interfacial layer between two dissimilar elastic half-planes
• Publication:4860692
• Stress distribution due to a pair of coplanar Griffith cracks at the interface of two bonded dissimilar elastic half-planes
• Solutions of thermoelastic crack problems in bonded dissimilar media or half-plane medium

zbMATH Keywords

exact solutionFourier transformsconstant prescribed temperature

Mathematics Subject Classification ID

Riemann-Hilbert problems in context of PDEs (35Q15) Thermodynamics in solid mechanics (74A15) Linear elasticity with initial stresses (74B10) Fracture and damage (74R99) Dual, triple, etc., integral and series equations (45F10)

Cited In (12)

• Thermoelastic interaction of two offset interfacial cracks in bonded dissimilar half-planes with a functionally graded interlayer
• Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
• Thermal stresses around a crack in the nonhomogeneous interfacial layer between two dissimilar elastic half-planes
• Thermal stresses around two parallel cracks in two bonded dissimilar elastic half-planes
• Relaxation of Thermal Stress Singularities in Bonded Viscoelastic Quarter Planes
• Modified solution of an interface rigid line between two bonded half-planes under remote in-plane heat flux
• Stress distribution due to a pair of coplanar Griffith cracks at the interface of two bonded dissimilar elastic half-planes
• Title not available (Why is that?)
• Title not available (Why is that?)
• Solution of problem of two dissimilar materials bonded at one interface subjected to temperature
• Thermoelastic problem of steady-state heat flows disturbed by a crack at an arbitrary angle to the graded interfacial zone in bonded materials
• A simple model for the study of the tolerance of interfacial crack under thermal load

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