A simple model for the study of the tolerance of interfacial crack under thermal load

DOI10.1007/S00707-013-0820-7zbMATH Open1398.74014OpenAlexW2045202956MaRDI QIDQ2393336FDOQ2393336

Brian Shaw, Jishan Zhang, Lifeng Ma, Ran He

Publication date: 7 August 2013

Published in: Acta Mechanica (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00707-013-0820-7

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• scientific article

Mathematics Subject Classification ID

Theories of fracture and damage (74A45) Thermal effects in solid mechanics (74F05) Fracture and damage (74R99)

Cites Work

• The determination of the elastic field of an ellipsoidal inclusion, and related problems
• Title not available (Why is that?)
• A Generalized Finite Element Method for polycrystals with discontinuous grain boundaries
• A fundamental model of cyclic instabilities in thermal barrier systems
• The formation of cracks as a result of plastic flow
• Numerically determined enrichment functions for the extended finite element method and applications to bi-material anisotropic fracture and polycrystals
• A Zener-Stroh crack near an interface
• Interface microcrack nucleation
• Growth of interfacial cracks in a TBC/superalloy system due to oxide volume induced internal pressure and thermal loading.
• Multiple Zener-Stroh crack problem in an infinite plate
• The use of conservative integral in bi-material interface crack problems subjected to thermal loads
• Interfacial Zener-Stroh Crack
• Zener’s Crack and the M-Integral

Cited In (2)

• Debonding fracture of bonded bimaterial semi‐strips subjected to concentrated forces and couples
• Thermal-mechanical interface crack behaviour of a surface mount solder joint

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