The effect of interfacial thermal resistance on interface crack subjected to remote heat flux
DOI10.1007/S00033-019-1235-7zbMATH Open1458.74036OpenAlexW2996077897WikidataQ126523987 ScholiaQ126523987MaRDI QIDQ2299231FDOQ2299231
Authors: Jie Wang, M. Dai, Cunfa Gao
Publication date: 20 February 2020
Published in: ZAMP. Zeitschrift für angewandte Mathematik und Physik (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1007/s00033-019-1235-7
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Cites Work
Cited In (11)
- Parameter of thermal rectification in the bimaterial with interfacial cracking
- The heat flows on the faces of interfacial crack, which filled thermo-conducting medium
- Heat concentration around a cylindrical interface crack in a composite tube
- Interaction between a cracked hole and a line crack under uniform heat flux
- A simple model for the study of the tolerance of interfacial crack under thermal load
- Thermal-mechanical interface crack behaviour of a surface mount solder joint
- Highly-conductive energetic coherent interfaces subject to in-plane degradation
- Thermal problem of interaction of partially insulated cracks in a bimaterial subjected by a heat flux
- A BEM analysis for thermomechanical closure of interfacial cracks incorporating friction and thermal resistance
- Effect of partial closure of an interfacial crack with heat-conducting filler and surface films under thermal loading of bimaterial
- РАЗРЕШИМОСТЬ ЗАДАЧИ О РАВНОВЕСИИ ДЛЯ ТЕРМОУПРУГОЙ ПЛАСТИНЫ КИРХГОФА – ЛЯВА С НАКЛОННОЙ ТРЕЩИНОЙ
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