The effect of interfacial thermal resistance on interface crack subjected to remote heat flux

From MaRDI portal
Publication:2299231

DOI10.1007/S00033-019-1235-7zbMATH Open1458.74036OpenAlexW2996077897WikidataQ126523987 ScholiaQ126523987MaRDI QIDQ2299231FDOQ2299231


Authors: Jie Wang, M. Dai, Cunfa Gao Edit this on Wikidata


Publication date: 20 February 2020

Published in: ZAMP. Zeitschrift für angewandte Mathematik und Physik (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1007/s00033-019-1235-7




Recommendations




Cites Work


Cited In (11)





This page was built for publication: The effect of interfacial thermal resistance on interface crack subjected to remote heat flux

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2299231)