The heat flows on the faces of interfacial crack, which filled thermo-conducting medium
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Publication:4565693
zbMATH Open1399.74038MaRDI QIDQ4565693FDOQ4565693
Authors: Kh. I. Serednytska, R. M. Martynyak
Publication date: 12 June 2018
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Cited In (4)
- Thermoelastic behavior of a bimaterial with interface crack filled with an incompressible fluid
- Parameter of thermal rectification in the bimaterial with interfacial cracking
- Thermal problem of interaction of partially insulated cracks in a bimaterial subjected by a heat flux
- Effect of partial closure of an interfacial crack with heat-conducting filler and surface films under thermal loading of bimaterial
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