Anisotropic heat conduction across an interface crack/defect filled with a thin interstitial medium

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Publication:973358

DOI10.1016/J.ENGANABOUND.2006.01.012zbMATH Open1187.74255OpenAlexW2062696814MaRDI QIDQ973358FDOQ973358

Y. C. Shiah, Yi-Xiao Shi

Publication date: 28 May 2010

Published in: Engineering Analysis with Boundary Elements (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1016/j.enganabound.2006.01.012




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