Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source

DOI10.1023/B:FRAC.0000040967.13962.ECzbMATH Open1300.74049OpenAlexW1997277302MaRDI QIDQ2519945FDOQ2519945

Vera E. Petrova, K. P. Herrmann

Publication date: 28 January 2009

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1023/b:frac.0000040967.13962.ec

Mathematics Subject Classification ID

Theories of fracture and damage (74A45) Thermal effects in solid mechanics (74F05) Fracture and damage (74R99)

Cited In (6)

• Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
• Edge-cracked bimaterial systems under thermal heating
• Two-dimensional steady-state general solution for isotropic thermoelastic materials with applications. II: Green's function for two-phase infinite plane
• Interior Cracking of a Circular Inclusion with Imperfect Interface under Thermal Loading
• The effect of interfacial thermal resistance on interface crack subjected to remote heat flux
• Thermal-mechanical interface crack behaviour of a surface mount solder joint

   Recommendations

• Title not available (Why is that?) 👍 👎
• Effect of partial closure of an interfacial crack with heat-conducting filler and surface films under thermal loading of bimaterial 👍 👎
• Thermal stress state in a bimaterial with a closed interface crack with rough surfaces 👍 👎
• The use of conservative integral in bi-material interface crack problems subjected to thermal loads 👍 👎
• A thermoelastic problem for interface cracks with contact zones 👍 👎

This page was built for publication: Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source

Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2519945)