Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source

DOI10.1023/B:FRAC.0000040967.13962.ECzbMATH Open1300.74049OpenAlexW1997277302MaRDI QIDQ2519945FDOQ2519945

Authors: Vera E. Petrova, K. P. Herrmann 

Publication date: 28 January 2009

Published in: International Journal of Fracture (Search for Journal in Brave)

Full work available at URL: https://doi.org/10.1023/b:frac.0000040967.13962.ec

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Mathematics Subject Classification ID

Theories of fracture and damage (74A45) Thermal effects in solid mechanics (74F05) Fracture and damage (74R99)

Cited In (8)

• Stress intensity factors for bonded two half planes weakened by thermally insulated cracks
• Edge-cracked bimaterial systems under thermal heating
• Two-dimensional steady-state general solution for isotropic thermoelastic materials with applications. II: Green's function for two-phase infinite plane
• Interior Cracking of a Circular Inclusion with Imperfect Interface under Thermal Loading
• The effect of interfacial thermal resistance on interface crack subjected to remote heat flux
• Interaction between heat dipole and circular interfacial crack
• Thermal-mechanical interface crack behaviour of a surface mount solder joint
• Thermal problem of interaction of partially insulated cracks in a bimaterial subjected by a heat flux

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