Klaus P. Herrmann

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Person:1418759

Available identifiers

zbMath Open herrmann.klaus-pMaRDI QIDQ1418759

List of research outcomes

PublicationDate of PublicationType
Static and extending interface cracks with contact zones in anisotropic as well as in piezoelectric bimaterials2017-01-25Paper
An interface crack with contact zones in a piezoelectric/piezomagnetic bimaterial2013-08-30Paper
https://portal.mardi4nfdi.de/entity/Q30155062011-07-13Paper
https://portal.mardi4nfdi.de/entity/Q36518682009-12-16Paper
Contact zone approach for a moving interface crack in a piezoelectric bimaterial under thermoelectromechanical loading2009-08-28Paper
Thermal crack problems for a bimaterial with an interface crack and internal defects subjected to a heat source2009-01-28Paper
https://portal.mardi4nfdi.de/entity/Q35105832008-07-03Paper
https://portal.mardi4nfdi.de/entity/Q35105942008-07-03Paper
On a moving interface crack with a contact zone in a piezoelectric bimaterial2007-10-15Paper
Contact zone assessment for a fast growing interface crack in an anisotropic bimaterial2005-12-13Paper
https://portal.mardi4nfdi.de/entity/Q30475672004-08-12Paper
Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings. I: Electrically permeable interface cracks.2004-03-14Paper
Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings. II: Electrically impermeable interface cracks.2004-03-14Paper
Fracture-mechanical assessment of electrically permeable interface cracks in piezoelectric bimaterials by consideration of various contact zone models2004-02-10Paper
On the lower bounds for critical loads under large deformations in non-linear hyperelastic composites with imperfect interlaminar adhesion2004-01-14Paper
Theoretical study of formation of pores in elastic solids: particulate composites, rubber toughened polymers, crazing.2003-03-11Paper
https://portal.mardi4nfdi.de/entity/Q27459312002-12-15Paper
https://portal.mardi4nfdi.de/entity/Q27589292002-05-14Paper
https://portal.mardi4nfdi.de/entity/Q27776552002-04-24Paper
https://portal.mardi4nfdi.de/entity/Q42690742001-12-04Paper
Determination of Mechanical Parameters of Solder Materials using the Miniature Measuring Method “Small Punch Test” and an Appropriate FE‐Simulation2001-01-14Paper
A contact zone approach for an interface crack in a piezoelectric anisotropic bimaterial2001-01-14Paper
https://portal.mardi4nfdi.de/entity/Q27776442001-01-01Paper
https://portal.mardi4nfdi.de/entity/Q42690732000-07-20Paper
Dynamic Behavior of Damaged Brittle Solids2000-07-20Paper
https://portal.mardi4nfdi.de/entity/Q42357941999-11-15Paper
On interface crack models with contact zones situated in an anisotropic bimaterial1999-11-08Paper
https://portal.mardi4nfdi.de/entity/Q42305521999-11-08Paper
https://portal.mardi4nfdi.de/entity/Q42358611999-11-08Paper
https://portal.mardi4nfdi.de/entity/Q42359031999-11-08Paper
https://portal.mardi4nfdi.de/entity/Q42359941999-11-08Paper
Delaminations induced by constrained transverse cracking in symmetric composite laminates1999-09-12Paper
https://portal.mardi4nfdi.de/entity/Q43505121998-11-01Paper
https://portal.mardi4nfdi.de/entity/Q43506001998-11-01Paper
Special approach for the determination of fracture mechanical parameters at an interface crack tip1998-10-18Paper
Numerical modelling of interface cracking in thermomechanically loaded elastoplastic bimaterials1998-01-07Paper
Rißausbreitungsvorgänge in thermomechanisch belasteten Zweikomponentenmedien: Analysis und Experiment1997-10-08Paper
Discontinuity Waves in a Periodic Layered Medium1997-05-05Paper
The stress field around a tensile crack interacting with a circular inclusion in a thermally stressed material1996-07-17Paper
Interaction of a Crack with a Circular Inclusion in a Thermally Stressed Material1996-02-11Paper
https://portal.mardi4nfdi.de/entity/Q42950161995-06-18Paper
https://portal.mardi4nfdi.de/entity/Q43107031994-11-02Paper
https://portal.mardi4nfdi.de/entity/Q43107041994-11-02Paper
https://portal.mardi4nfdi.de/entity/Q42949611994-07-27Paper
https://portal.mardi4nfdi.de/entity/Q42950131994-07-27Paper
https://portal.mardi4nfdi.de/entity/Q33420421983-01-01Paper
https://portal.mardi4nfdi.de/entity/Q36575471982-01-01Paper
Quasistatic thermal crack growth in the viscoelastic matrix material of a brittle fiber reinforced unit cell1981-01-01Paper
https://portal.mardi4nfdi.de/entity/Q39011531980-01-01Paper
https://portal.mardi4nfdi.de/entity/Q41274531977-01-01Paper
https://portal.mardi4nfdi.de/entity/Q41281331976-01-01Paper
K. Seeger, Semiconductor Physics. (Edition Physics). XV + 514 S. m. 372 Fig. Wien/New York 1973. Springer-Verlag. Preis brosch. DM 60,–1975-01-01Paper
https://portal.mardi4nfdi.de/entity/Q40531741971-01-01Paper
Ergänzende Bemerkung zur Arbeit 'Über ein ebenes inhomogenes Problem der Thermoelastizität'1970-01-01Paper
Über ein ebenes inhomogenes Problem der Thermoelastizität1968-01-01Paper
Geschlossene Lösung eines ebenen Temperaturspannungsproblems bei Vorliegen einer aus stetigen und unstetigen Anteilen zusammengesetzten Temperaturverteilung1966-01-01Paper

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