Investigation of model parameters of lead-containing and lead-free solders
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Publication:3510583
DOI10.1002/1617-7061(200203)1:1%3C179::AID-PAMM179%3E3.0.CO;2-OzbMATH Open1419.74019OpenAlexW1993634118MaRDI QIDQ3510583FDOQ3510583
Authors: v. S. Nguyen, K. P. Herrmann, Wolfgang H. Müller 
Publication date: 3 July 2008
Full work available at URL: https://doi.org/10.1002/1617-7061(200203)1:1%3C179::aid-pamm179%3E3.0.co;2-o
Recommendations
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
- Determining material parameter of solder alloys by nanoindentation
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder
- Solder joint lifetime assessment of electronic devices
- Failure analysis of solder joints with a damage‐coupled viscoplastic model
Finite element methods applied to problems in solid mechanics (74S05) Experimental work for problems pertaining to mechanics of deformable solids (74-05)
Cited In (11)
- Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging
- Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
- Some Physical Properties of Wiping Solders*
- Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods
- Determining material parameter of solder alloys by nanoindentation
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder
- Effects of the solder phase transformation on the optimization of reflow soldering parameters and temperature profiles
- Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?
- Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder
- Phase field dependent viscoplastic behaviour of solder alloys
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