Investigation of model parameters of lead-containing and lead-free solders

DOI10.1002/1617-7061(200203)1:1%3C179::AID-PAMM179%3E3.0.CO;2-OMaRDI QIDQ3510583zbMATH OpenOpenAlexFDO

Authors v. S. Nguyen, K. P. Herrmann, Wolfgang H. Müller

Publication date 3 July 2008

Full work available at URL https://doi.org/10.1002/1617-7061(200203)1:1%3C179::aid-pamm179%3E3.0.co;2-o

Mathematics Subject Classification ID

Finite element methods applied to problems in solid mechanics (74S05) Experimental work for problems pertaining to mechanics of deformable solids (74-05)

Recommendations

• Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
• Determining material parameter of solder alloys by nanoindentation
• Microstructure-dependent viscoplastic damage modelling of tin-lead solder
• Solder joint lifetime assessment of electronic devices
• Failure analysis of solder joints with a damage‐coupled viscoplastic model

Cited in

(11)

• Mathematical modeling for the solidification heat-transfer phenomena during the reflow process of lead--tin alloy solder joint in electronics packaging
• Reexamination of the solder ball shear test for evaluation of the mechanical joint strength
• Some Physical Properties of Wiping Solders*
• Creep in microelectronic solder joints: finite element simulations versus semi-analytical methods
• Determining material parameter of solder alloys by nanoindentation
• Microstructure-dependent viscoplastic damage modelling of tin-lead solder
• Effects of the solder phase transformation on the optimization of reflow soldering parameters and temperature profiles
• Nanoindentation: a suitable tool to determine local mechanical properties in microelectronic packages and materials?
• Comparative study on stress-strain hysteresis response of SAC solder joints under thermal cycles
• A nonlocal diffuse interface model for microstructure evolution of tin--lead solder
• Phase field dependent viscoplastic behaviour of solder alloys

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