Phase field dependent viscoplastic behaviour of solder alloys
DOI10.1016/J.IJSOLSTR.2004.10.008zbMATH Open1094.74012OpenAlexW2077283218MaRDI QIDQ2500547FDOQ2500547
Authors: R. L. J. M. Ubachs, P. J. G. Schreurs, M. G. D. Geers 
Publication date: 17 August 2006
Published in: International Journal of Solids and Structures (Search for Journal in Brave)
Full work available at URL: https://doi.org/10.1016/j.ijsolstr.2004.10.008
Recommendations
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder
- Failure analysis of solder joints with a damage‐coupled viscoplastic model
- A nonlocal diffuse interface model for microstructure evolution of tin--lead solder
- Phase‐field‐based modeling and simulation of solidification and deformation behavior of technological alloys
- Investigation of model parameters of lead-containing and lead-free solders
Finite element methods applied to problems in solid mechanics (74S05) Small-strain, rate-dependent theories of plasticity (including theories of viscoplasticity) (74C10)
Cited In (7)
- Some Physical Properties of Wiping Solders*
- Modelling inheritance of plastic deformation during migration of phase boundaries using a phase field method
- Microstructure-dependent viscoplastic damage modelling of tin-lead solder
- Homogenization of viscoplastic constitutive laws within a phase field approach
- An integrated fast Fourier transform-based phase-field and crystal plasticity approach to model recrystallization of three dimensional polycrystals
- Computational modeling of mineral unmixing and growth. An application of the Cahn-Hilliard equations
- Failure analysis of solder joints with a damage‐coupled viscoplastic model
This page was built for publication: Phase field dependent viscoplastic behaviour of solder alloys
Report a bug (only for logged in users!)Click here to report a bug for this page (MaRDI item Q2500547)
