Contact zone approach for a moving interface crack in a piezoelectric bimaterial under thermoelectromechanical loading
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Recommendations
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Cites work
- scientific article; zbMATH DE number 858427 (Why is no real title available?)
- scientific article; zbMATH DE number 3066733 (Why is no real title available?)
- A moving conducting crack at the interface of two dissimilar piezoelectric materials.
- Contact zone assessment for a fast growing interface crack in an anisotropic bimaterial
- Elastodynamic parameters for dynamic interface fracture mechanics
- Explicit crack-tip fields of an extending interface crack in an anisotropic bimaterial
- Fracture in fully coupled dynamic thermoelasticity
- Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings. I: Electrically permeable interface cracks.
- Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings. II: Electrically impermeable interface cracks.
- Fracture mechanics of interfacial cracks
- Fracture-mechanical assessment of electrically permeable interface cracks in piezoelectric bimaterials by consideration of various contact zone models
- Mechanics of dynamic debonding
- On a moving interface crack with a contact zone in a piezoelectric bimaterial
- Temperature determination for a contacting body based on an inverse piezothermoelastic problem
- The Interface Crack
Cited in
(10)- Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings. I: Electrically permeable interface cracks.
- Fracture mechanical assessment of interface cracks with contact zones in piezoelectric bimaterials under thermoelectromechanical loadings. II: Electrically impermeable interface cracks.
- Contact zone assessment for a fast growing interface crack in an anisotropic bimaterial
- On a moving interface crack with a contact zone in a piezoelectric bimaterial
- Dynamic thermoelectroelastic fields near non-smooth moving boundaries of media interface
- Motion of an electrically insulated interface crack with constant subcritical velocity in a piezoelectric bimaterial
- Static and extending interface cracks with contact zones in anisotropic as well as in piezoelectric bimaterials
- A moving thermal dielectric crack in piezoelectric ceramics with a shearing force applied on its surface
- An analytically-numerical approach for the analysis of an interface crack with a contact zone in a piezoelectric bimaterial compound
- Pre-kinking analysis of a constant moving crack in a magnetoelectroelastic strip under in-plane loading
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