Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components (Q1001042): Difference between revisions
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| Property / cites work: Coupled thermal and hydrodynamic models of flat micro heat pipes for the cooling of multiple electronic components / rank | |||
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| Property / cites work: Q2717244 / rank | |||
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| Property / cites work: A quasi-3D analysis of the thermal performance of a flat heat pipe / rank | |||
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| Property / cites work: Q3999651 / rank | |||
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| Property / cites work: Recent advances in the numerical analysis of heat pipes / rank | |||
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Latest revision as of 01:11, 29 June 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components |
scientific article |
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Transient thermal and hydrodynamic model of flat heat pipe for the cooling of electronics components (English)
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12 February 2009
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electronics
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heat pipe
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phase change
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transient
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