Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction (Q2245879): Difference between revisions
From MaRDI portal
Removed claim: author (P16): Item:Q278461 |
Changed an Item |
||
| Property / author | |||
| Property / author: Lin-Lin Wang / rank | |||
Normal rank | |||
Revision as of 10:11, 12 February 2024
scientific article
| Language | Label | Description | Also known as |
|---|---|---|---|
| English | Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction |
scientific article |
Statements
Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction (English)
0 references
15 November 2021
0 references
damping modeling
0 references
three-dimensional heat conduction
0 references
Kirchhoff-Love microplate
0 references
thermoelastic
0 references
