Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction (Q2245879): Difference between revisions

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Revision as of 07:26, 5 March 2024

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Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction
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    Elastothermodynamic damping modeling of three-layer Kirchhoff-Love microplate considering three-dimensional heat conduction (English)
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    15 November 2021
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    damping modeling
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    three-dimensional heat conduction
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    Kirchhoff-Love microplate
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    thermoelastic
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